Honor Magic V Flip vs

HONOR MAGIC V FLIP

Coming Soon

Honor Magic V Flip
Network
Technology GSM / CDMA / HSPA / CDMA2000 / LTE / 5G
2G bands GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
  CDMA 800
3G bands HSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100
  CDMA2000 1x
4G bands LTE
5G bands SA/NSA
Speed HSPA, LTE, 5G
Launch
Announced 2024, June 13
Status Rumored. Exp. release 2024, June 19
Body
Dimensions Unfolded: 167.3 x 75.6 x 7.2 mm
Folded: 86.5 x 75.6 x 14.9 mm
Weight 193 g (6.81 oz)
Build Aluminum frame
SIM Dual SIM (Nano-SIM, dual stand-by)
Display for Honor Magic V Flip
Type Foldable LTPO OLED, 1B colors, 120Hz, HDR, Dolby Vision, BT.2020, 3000 nits (peak)
Size 6.8 inches, 108.0 cm2 (~85.4% screen-to-body ratio)
Resolution 1080 x 2520 pixels, 21:9 ratio (~403 ppi density)
 Cover display:
LTPO OLED, 4 inch, 1200 x 1092 pixels, 405 ppi, 120Hz, HDR, Dolby Vision, 1600 nits (HBM)
Platform
OS Android 14, MagicOS 8
Chipset Qualcomm SM8475 Snapdragon 8+ Gen 1 (4 nm)
CPU Octa-core (1x3.0 GHz Cortex-X2 & 3x2.5 GHz Cortex-A710 & 4x1.80 GHz Cortex-A510)
GPU Adreno 730
Memory
Card slot No
Internal 256GB 12GB RAM, 512GB 12GB RAM, 1TB 12GB RAM, 1TB 16GB RAM
Main Camera
Dual 50 MP, f/1.9, 23mm (wide), 1/1.56", 1.0µm, PDAF, OIS
12 MP, f/2.2, 112Ëš (ultrawide), AF
Features LED flash, HDR, panorama
Video 4K, 1080p, gyro-EIS
Selfie camera
Single 50 MP, f/2.0, (wide), AF
Video 4K, 1080p
Sound
Loudspeaker Yes, with stereo speakers
3.5mm jack No
Comms
WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
Bluetooth 5.3, A2DP, LE, aptX HD
Positioning GPS, GALILEO, GLONASS, QZSS, BDS (B1I+B1c)
NFC Yes
Radio No
USB USB Type-C 2.0, OTG
Features
Sensors Fingerprint (side-mounted), gyro, accelerometer, proximity (ultrasonic), compass
Battery
Type Si/C 4800 mAh, non-removable
Charging 66W wired, 45% in 15 min (advertised)
5W reverse wired
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